Radiation fin structure

ABSTRACT

A radiation fin structure aims to disperse heat for personal or notebook computers and peripheral devices thereof. The structure includes a base deck at the bottom end of the radiation fins with grid type passages formed therein to form a closed loop. The closed loop is filled with a liquid or gas heat dissipation medium to the amount about 50% to 90% of the internal volume capacity of the grid type passages. When the base deck is in contact with the contact surface of a computer heat generating element, heat concentrates on the heat absorption end of the base deck and is transferred to the fin-type heat dissipation section to be dispelled by a fan to improve heat dissipation effect.

FIELD OF THE INVENTION

The present invention relates to a radiation fin structure for improvingheat dissipation.

BACKGROUND OF THE INVENTION

The radiator for personal computers or notebook computers generally hasa fan fixedly mounted onto the radiation fins. The radiation fins areclamped on a computer heat generating element through an eccentricfixture. During heat dissipation process, the eccentric fixture is proneto skew and results in the radiation fins not in direct contact with thecomputer heat generating element. Therefore heat generated by thecomputer heat generating element concentrates on the contact surface,while airflow generated by the fan does not blow in a converged fashionbut around the surrounding. Moreover, the radiation fins simply rely onmetal thermal conduction principle to disperse heat. Namely, thecomputer heat generating element transfers heat through the contactsurface to the base deck of the radiator. Then the heat is transferredto the radiation fins to be carried away by the airflow generated by thefan. The heat dissipation efficiency of such an approach is determinedby the thermal conductivity power of the metal that is used to fabricatethe radiator. As solid substance has limited thermal conductivity power,heat dissipation effect of the known radiator also is limited. To remedythis problem, the present invention provides a closed chamber structurethat is filled with a liquid or gas heat dissipation medium. Itmaintains the original metal thermal conductive heat dissipationapproach, also includes a medium convection heat dissipation approach.Therefore heat dissipation effect may be improved.

SUMMARY OF THE INVENTION

In view of the aforesaid disadvantages occurred to the conventionalradiation fins that do not provide desirable heat dissipation effect,applicant aims to provide an improved radiation fin structure that has abase deck which has a closed loop consisting of grid type passages. Theclosed loop is filled with a liquid or gas heat dissipation medium tothe amount about 50% to 90% of the internal volume capacity of the gridtype passages. Heat concentrates on a heat absorption end of the basedeck and passes through the radiation fins to be dispelled by the fan toachieve heat dissipation effect.

The structure set forth can achieve the following advantages:

1. The base deck at the bottom end of the radiation fins has grid typepassages to form a closed loop to contain a liquid or gas heatdissipation medium. It maintains the original metal thermal conductiveheat dissipation approach, also includes a medium convection heatdissipation approach. Therefore heat dissipation effect may be improved.

2. The radiation fin structure according to the invention consists ofaluminum radiation fins with a closed loop formed therein. Heat on thecontact surface of the heat generating element (at a higher temperature)concentrates on the heat absorption end of the base deck, and passesthrough the radiation fins to be dispelled by the fan. Thus heatdissipation effect may be improved.

3. The radiation fins of the invention are in contact with the contactsurface of the heat generating element so that the heat absorption endof the base deck at the bottom can converge heat which passes throughthe radiation fins to be dispelled by the fan. The contact area isevenly formed and has an improved heat conduction coefficient. This alsocan enhance heat dissipation effect.

The foregoing, as well as additional objects, features and advantages ofthe invention will be more readily apparent from the following detaileddescription, which proceeds with reference to the accompanying drawings.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a perspective view of a first embodiment of the presentinvention.

FIG. 2 is a front view of FIG. 1.

FIG. 3 is a schematic view of circulating heat dissipation by the heatdissipation medium according to FIG. 1.

FIG. 4 is a schematic view of circulating heat dissipation by the heatdissipation medium according to a second embodiment of the invention.

FIG. 5 is a schematic view of circulating heat dissipation by the heatdissipation medium according to a third embodiment of the invention.

FIG. 6 is a schematic view of circulating heat dissipation by the heatdissipation medium according to a fourth embodiment of the invention.

FIG. 7 is a perspective view of a fifth embodiment of the invention.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

Please refer to FIGS. 1 and 2 for a first embodiment of the invention.The radiation fin structure according to the invention includes a basedeck 10 and a fin-type heat dissipation section 11. It is adopted foruse on personal computers or notebook computers and peripheral devicesthereof for dispersing heat.

The base deck 10 is in contact with a heat generating element of acomputer to absorb heat. The base deck 10 has grid type passages 102formed therein that consist of longitudinal and transverse passages onneighboring sides communicating with one another to form a closed loop100. The closed loop 100 is filled with a liquid or gas heat dissipationmedium 101 to the amount about 50% to 90% of the internal volumecapacity of the grid type passages 102 (shown by arrows in FIG. 3).

The fin-type heat dissipation section 11 is located above the base deck10 which has a heat absorption end to absorb heat and transfer the heatthrough the fin-type heat dissipation section 11 to be dispelled by afan.

Referring to FIG. 3, the grid type passages 102 are formed in the basedeck 10. They have outlets sealed by pliable plugs 103. The grid typepassages 102 form a closed loop 100 which is filled with a liquid or gasheat dissipation medium 101 to the amount about 50% to 90% of theinternal volume capacity of the grid type passages 102 (shown by arrowsin FIG. 3). When the base deck 10 is in contact with the contact surfaceof the computer heat generating element, the heat dissipation medium 101in the base deck 10 gathers heat generated by the computer heatgenerating element to the heat absorption end of the base deck 10, thenthe heat is transferred to the fin-type heat dissipation section 11 tobe dispelled by the fan to achieve optimal heat dissipation effect.

Refer to FIG. 4 for a second embodiment of the invention. It isconstructed largely like the first embodiment shown in FIG. 1. Thedifference is that reciprocal passages 102 a are formed by machining inthe base deck 10 a at the bottom end of the radiation fins with outletssealed by pliable plugs 103 a. The reciprocal passages 102 a form aclosed loop 100 a which is filled with a liquid or gas heat dissipationmedium 101 to the amount about 50% to 90% of the internal volumecapacity of the reciprocal passages 102 a (shown by arrows in FIG. 4).When the base deck 10 a is in contact with the contact surface of thecomputer heat generating element, heat concentrates on the heatabsorption end of the base deck 10 a, and is transferred to the fin-typeheat dissipation section to be dispelled by the fan to achieve optimalheat dissipation effect.

Refer to FIG. 5 for a third embodiment of the invention. It isconstructed largely like the first embodiment shown in FIG. 1. Thedifference is that the grid type passages 102 b fabricated by machiningin the base deck 10 b with outlets sealed by pliable plugs 103 b form anopen-type loop 10 b. The base deck 10 b has an outlet connection end 104b on one side and an inlet connection end 105 b on another side thereofto form a circulation system. When the base deck 10 b is in contact withthe contact surface of the computer heat generating element, heatconcentrates on the heat absorption end of the base deck 10 b, and isexchanged through an external heat exchanger, then is transferred to thefin-type heat dissipation section to be dispelled by the fan to achieveoptimal heat dissipation effect.

Refer to FIG. 6 for a fourth embodiment of the invention. It isconstructed largely like the third embodiment shown in FIG. 5. Thedifference is that a reciprocal loop 100 c is formed in the base deck 10c. The reciprocal loop 100 c may be connected to an external heatexchanger, then is transferred to the fin-type heat dissipation sectionto dispel heat by the fan.

Refer to FIG. 7 for a fifth embodiment of the invention. It isconstructed largely like the first embodiment shown in FIG. 1. Thedifference is that the radiation fins 1 d are to be housed in the heatgenerating space. While it has a base deck 10 d with the same height asthe one in the embodiment shown in FIG. 1, the radiation fins 1 dlocated above the base deck 10 d are formed with different heights andarranged in different densities.

1. A radiation fin structure, comprising: a base deck having gird typepassages formed therein consisting of longitudinal and transversepassages on neighboring sides communicating with one another to form aclosed loop which is filled with a heat dissipation medium; and afin-type heat dissipation section located above the base deck.
 2. Theradiation fin structure of claim 1, wherein the heat dissipation mediumis liquid or gas.
 3. The radiation fin structure of claim 1, wherein theheat dissipation medium is filled to the amount about 50% to 90% of theinternal volume capacity of the gird type passages.
 4. The radiation finstructure of claim 1, wherein the closed loop has reciprocal passages.5. The radiation fin structure of claim 1, wherein the base deck has anoutlet connection end on one side and an inlet connection end on anotherside thereof to form an open loop circulation system.
 6. The radiationfin structure of claim 5, wherein the open loop is connected to anexternal heat exchange circulation system.
 7. The radiation finstructure of claim 1, wherein the radiation fins are located in a heatgeneration space on the base deck of a same height and have differentheights and are arranged in different densities.